企业安全生产相关培训PPT-倒装焊与芯片级封装技术的研究（PPT10页）

倒裝焊与晶片級封裝技術的研
究
Why Flip Chip?
◼ Better manufacturing yield than wirebond for high
pin-count chips.
對于高密度引腳芯片，成品率优于丝键合。
◼ Faster manufacturing through-put than wirebond for
high pin-count chips.
對于高密度引腳芯片，生产效率高于丝键合。
◼ More reliability than wirebonded chips.
可靠性优于丝键合封装芯片。
◼ Better electrical characteristics (less inductance) for
high-speed chips. A must for RF, optoelectronics,
high-speed digital (>500MHz).
对于高速芯片，具有良好的电学性能。